Fiber LaserUltrashort Pulse LaserVCSELs
Focuses on core laser generation technologies, covering fiber lasers, DPSSL, carbon dioxide lasers, ultrashort pulse lasers, excimer lasers, semiconductor lasers, and VCSELs.
CuttingWeldingNon-Contact Measurement
Showcases laser processing and line integration capabilities, including engraving, cutting, welding, drilling, cleaning, non-contact measurement, inspection, and automation system integration.
MicroelectronicsPCB / FPCHard and Brittle Materials
Targets precision manufacturing scenarios for microelectronics, displays, PCB/FPC substrates, passive components, composites, fabrics, paper, wood, and other micromachining applications.
Thick Plate CuttingHigh-Power WeldingLaser Cleaning
Focuses on equipment and solutions for high-load processing scenarios such as thick metal cutting, deep engraving, cladding, drilling, battery and metal welding, and laser cleaning.
Wafer ProcessingLithographyAblation & Structuring
Covers laser applications across semiconductor manufacturing, including wafer processing, lithography, cutting, ablation, and structuring for advanced process flows.
DisplaysGlass ProcessingComposite Materials
Showcases laser-enabled processing and manufacturing solutions for the optoelectronics industry, serving display, glass, composite, and related precision production applications.
Optical LensOptical MaterialsOptical Inspection
Brings together optical lenses, plastic optical lenses, optical devices, optical materials, peripheral products, and optical inspection solutions for precision optics needs.
Laser CrystalsScanning GalvanometersSafety Equipment
Covers laser crystals, chips, power supplies, Q-switches, scanning galvanometers, filters, polarizers, motion platforms, cooling systems, safety equipment, and other supporting components.
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