
BOND Shenzhen 2026 is a trade platform focused on adhesives, sealants, adhesive tapes and labels, related raw materials, and dispensing equipment for manufacturing applications across South China and the wider domestic market.
Held from June 10 to 12, 2026 at Shenzhen World Exhibition & Convention Center, the show serves professionals from consumer electronics, packaging and printing, power supply, automotive, electronics, home appliances, building materials, footwear and textiles, semiconductors, optoelectronics, medical devices, and new energy industries, alongside technical seminars and exchange activities.



Guangdong Adhesives Industry Association supports industry coordination for this exhibition.






Guangdong Adhesives Industry Association supports industry coordination for this exhibition.