
CIOE2026
Edition27 A full-chain optoelectronics expo covering information communications, precision optics, lasers, infrared, sensing, displays, and AR/VR sourcing needs.
CIOE2026 will take place from September 9 to 11, 2026 at Shenzhen World Exhibition & Convention Center (Bao'an New Hall). It is a comprehensive trade show covering the full optoelectronics industry chain.
The event features eight themed shows covering information and communication, precision optics, camera technology and applications, laser technology and intelligent manufacturing, infrared and ultraviolet technologies, intelligent sensing, display technologies, AR & VR, and photonics innovation. It provides a one-stop sourcing platform for materials, components, equipment, and solutions used in R&D and manufacturing.
The 2026 edition is expected to span 260,000 square meters, bring together more than 4,000 exhibitors from over 30 countries and regions, attract more than 150,000 professional visitors, and host 90 concurrent conferences. It will be co-located with IICIE and elexcon Shenzhen to connect optoelectronics, integrated circuits, electronics, and embedded systems.

CIOE2026
Edition27 A full-chain optoelectronics expo covering information communications, precision optics, lasers, infrared, sensing, displays, and AR/VR sourcing needs.
CIOE2026 will take place from September 9 to 11, 2026 at Shenzhen World Exhibition & Convention Center (Bao'an New Hall). It is a comprehensive trade show covering the full optoelectronics industry chain.
The event features eight themed shows covering information and communication, precision optics, camera technology and applications, laser technology and intelligent manufacturing, infrared and ultraviolet technologies, intelligent sensing, display technologies, AR & VR, and photonics innovation. It provides a one-stop sourcing platform for materials, components, equipment, and solutions used in R&D and manufacturing.
The 2026 edition is expected to span 260,000 square meters, bring together more than 4,000 exhibitors from over 30 countries and regions, attract more than 150,000 professional visitors, and host 90 concurrent conferences. It will be co-located with IICIE and elexcon Shenzhen to connect optoelectronics, integrated circuits, electronics, and embedded systems.
Area
Exhibitors
Visitors

Ganzin NPU chipset eye tracking solution、AR/AI Glasses Reference Design

Full-color LEDoS CMOS Backplane (S22MM21)、2.5D Micro Pixel Driver® Platform (S23LM61)、Mono-color LEDoS CMOS Backplane (S26MM21)、3D Micro Pixel Driver® Platform (S25LM81)
CIOE 2025 drew 143,645 professional visitors across optical communications, advanced manufacturing, consumer electronics, semiconductors, sensing, displays, medical and energy sectors.
Shen Ping, Current Global President, IEEE Photonics Society; Sun Hongbo, Member of the Chinese Academy of Sciences; Professor, Tsinghua University; Roman Romashko, Far Eastern Branch of Russian Academy of Sciences, Russia; Wang Qionghua, Professor, Beihang University
Axel Clouet, PhD, Product Marketing Manager, Yole Group; Ang Wee Seng, Executive Director, Singapore Semiconductor Industry Association (SSIA); Qiu Yubin, Senior Vice President of Research, TrendForce; Terry Teh, Chief Executive Officer, Advinno Technologies Pte Ltd; Kimon Moratis, Market Research Director, TEMATYS; Kong Lingbao, Professor, Fudan University; Sukumar Verma, Managing Director, Informa Singapore
Zhang Haiyi, Director, Institute of Technology and Standards Research, China Academy of Information and Communications Technology; Tang Xiongyan, Vice President and Chief Scientist, China Unicom Research Institute; Zhang Dejiang, Chief Optical Systems Expert, Huawei Technologies Co., Ltd.; Li Junjie, Vice Dean, China Telecom Research Institute; Zhang Hanzheng, General Manager, Optical Networks Business Division, Nokia Shanghai Bell Co., Ltd.; Wu Yuanyuan, Deputy General Manager, Suzhou Suna Optoelectronics Co., Ltd.; Han Liuyan, Technical Manager, China Mobile Research Institute; Chen Yong, Chief Engineer, OTN Product Planning, ZTE Corporation; Yao Wenwei, Senior Engineer, Wuhan Yilutong Technology Co., Ltd.; Zhang Jie, Vice President for Academic Affairs, Inner Mongolia University of Technology; Deputy Director, State Key Laboratory of Information Photonics and Optical Communications; Cao Li, Senior Analyst, LightCounting
Ao Li, Vice Dean, China Academy of Information and Communications Technology; Zheng Zongzhao, Chief Optical Access Architect, Huawei; Zhang Dechao, Deputy Director, Institute of Fundamental Network Technology, China Mobile Research Institute; Li Mingsheng, Chief Engineer for Optical Access Planning, ZTE; Zhang Dezhi, Director, Optical Access Network Center, China Telecom Research Institute; Wang Guangquan, Chief Engineer, China Unicom Research Institute; Xuan Chuanwu, Equipment Director, Jiangsu Hengtong Optic-Electric Co., Ltd.; Wei Zixian, Researcher, The Hong Kong Polytechnic University; Wang Zhijun, Technical Expert, FiberHome
Huang Yidong, Professor; International Member, US National Academy of Engineering, Tsinghua University; Chang Ruihua, Chairman; Foreign Member, Chinese Academy of Engineering; Member, US National Academy of Engineering, Shenzhen Bosheng Optoelectronics Technology Co., Ltd.; Wang Jun, Executive Deputy General Manager and Chief Technology Officer, Suzhou Everbright Photonics Co., Ltd.; Liang Xuerui, R&D Manager, Accelink Technologies Co., Ltd.; Xu Yili, Founder, Hangzhou Wuwen Qingxin Quantum Computing Technology Co., Ltd.; Shi Kebin, Professor, Peking University / Yangtze Delta Institute of Optoelectronics, Peking University
Fan Nanfeng, Secretariat, GCPA Alliance; Li Houcheng, Secretariat, GCPA Alliance; Zhu Binbin, Founder and Chairman, Shenzhen Huachuangxinguang Technology Co., Ltd.; Zeng Cheng, Researcher, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences; Cai Zhengye, Global Senior Applications Technology Manager, Aledia; Zang Kai, CEO, Adaps Photonics Technology Co., Ltd.; Ni Mingming, Applications Technology Director, WG Tech; Qian Xuexing, General Manager, Chenri Technology; Liu Chuan, Solutions Director, Aqiu Technology
The fair is held on September 9-11, 2026.
The venue is Shenzhen World Exhibition & Convention Center (Bao'an New Hall).
Area
Exhibitors
Visitors

Ganzin NPU chipset eye tracking solution、AR/AI Glasses Reference Design

Full-color LEDoS CMOS Backplane (S22MM21)、2.5D Micro Pixel Driver® Platform (S23LM61)、Mono-color LEDoS CMOS Backplane (S26MM21)、3D Micro Pixel Driver® Platform (S25LM81)
CIOE 2025 drew 143,645 professional visitors across optical communications, advanced manufacturing, consumer electronics, semiconductors, sensing, displays, medical and energy sectors.
Shen Ping, Current Global President, IEEE Photonics Society; Sun Hongbo, Member of the Chinese Academy of Sciences; Professor, Tsinghua University; Roman Romashko, Far Eastern Branch of Russian Academy of Sciences, Russia; Wang Qionghua, Professor, Beihang University
Axel Clouet, PhD, Product Marketing Manager, Yole Group; Ang Wee Seng, Executive Director, Singapore Semiconductor Industry Association (SSIA); Qiu Yubin, Senior Vice President of Research, TrendForce; Terry Teh, Chief Executive Officer, Advinno Technologies Pte Ltd; Kimon Moratis, Market Research Director, TEMATYS; Kong Lingbao, Professor, Fudan University; Sukumar Verma, Managing Director, Informa Singapore
Zhang Haiyi, Director, Institute of Technology and Standards Research, China Academy of Information and Communications Technology; Tang Xiongyan, Vice President and Chief Scientist, China Unicom Research Institute; Zhang Dejiang, Chief Optical Systems Expert, Huawei Technologies Co., Ltd.; Li Junjie, Vice Dean, China Telecom Research Institute; Zhang Hanzheng, General Manager, Optical Networks Business Division, Nokia Shanghai Bell Co., Ltd.; Wu Yuanyuan, Deputy General Manager, Suzhou Suna Optoelectronics Co., Ltd.; Han Liuyan, Technical Manager, China Mobile Research Institute; Chen Yong, Chief Engineer, OTN Product Planning, ZTE Corporation; Yao Wenwei, Senior Engineer, Wuhan Yilutong Technology Co., Ltd.; Zhang Jie, Vice President for Academic Affairs, Inner Mongolia University of Technology; Deputy Director, State Key Laboratory of Information Photonics and Optical Communications; Cao Li, Senior Analyst, LightCounting
Ao Li, Vice Dean, China Academy of Information and Communications Technology; Zheng Zongzhao, Chief Optical Access Architect, Huawei; Zhang Dechao, Deputy Director, Institute of Fundamental Network Technology, China Mobile Research Institute; Li Mingsheng, Chief Engineer for Optical Access Planning, ZTE; Zhang Dezhi, Director, Optical Access Network Center, China Telecom Research Institute; Wang Guangquan, Chief Engineer, China Unicom Research Institute; Xuan Chuanwu, Equipment Director, Jiangsu Hengtong Optic-Electric Co., Ltd.; Wei Zixian, Researcher, The Hong Kong Polytechnic University; Wang Zhijun, Technical Expert, FiberHome
Huang Yidong, Professor; International Member, US National Academy of Engineering, Tsinghua University; Chang Ruihua, Chairman; Foreign Member, Chinese Academy of Engineering; Member, US National Academy of Engineering, Shenzhen Bosheng Optoelectronics Technology Co., Ltd.; Wang Jun, Executive Deputy General Manager and Chief Technology Officer, Suzhou Everbright Photonics Co., Ltd.; Liang Xuerui, R&D Manager, Accelink Technologies Co., Ltd.; Xu Yili, Founder, Hangzhou Wuwen Qingxin Quantum Computing Technology Co., Ltd.; Shi Kebin, Professor, Peking University / Yangtze Delta Institute of Optoelectronics, Peking University
Fan Nanfeng, Secretariat, GCPA Alliance; Li Houcheng, Secretariat, GCPA Alliance; Zhu Binbin, Founder and Chairman, Shenzhen Huachuangxinguang Technology Co., Ltd.; Zeng Cheng, Researcher, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences; Cai Zhengye, Global Senior Applications Technology Manager, Aledia; Zang Kai, CEO, Adaps Photonics Technology Co., Ltd.; Ni Mingming, Applications Technology Director, WG Tech; Qian Xuexing, General Manager, Chenri Technology; Liu Chuan, Solutions Director, Aqiu Technology
The fair is held on September 9-11, 2026.
The venue is Shenzhen World Exhibition & Convention Center (Bao'an New Hall).