Overview

International Integrated Circuit Innovation Expo 2026 will be held from September 9 to 11, 2026 at Shenzhen World Exhibition and Convention Center in Shenzhen, China. The event covers the semiconductor value chain across IC products and applications, wafer fabrication, packaging and testing, semiconductor equipment, semiconductor materials, and core parts.

The expo facilitates direct engagement with IDM, Fabless, Fab, and OSAT participants while connecting professionals from AI, consumer electronics, automotive, communications and computing, display, optoelectronics, and new energy sectors. The show is co-located with CIOE to extend sourcing and cross-industry exchange across semiconductor and optoelectronic ecosystems.

The projected 2026 scale encompasses 60,000 sqm of exhibition area, 1,100+ exhibitors, 60,000+ professional visitors, and 20+ conferences, positioning the expo as a large-scale trade and innovation platform for integrated circuit and semiconductor collaboration.

1,100家

Exhibitors

70,000人

Visitors

60,000m²

ChipsEDA/IPPackaging and Testing

Covers IC chips, design services, EDA/IP, OSAT, packaging equipment, testing equipment, and themed focuses such as advanced packaging and advanced computing.

Wafer FabricationFoundryMetrology Equipment

Focuses on wafer fabrication and foundry, IC manufacturing equipment, metrology equipment, substrate and manufacturing consumables, and core parts, with a theme area for research institute achievements.

Power DevicesSubstratesAutomotive Chips

Encompasses power devices and modules, materials and substrates, manufacturing equipment, packaging and testing equipment, core components, and themed content around automotive chips and power semiconductors.

Manufacturing EquipmentInspection and TestFactory Automation

Showcases manufacturing, packaging, inspection, test, assembly, environmental control, and factory automation or robot-related equipment for semiconductor production lines.

Substrate MaterialsManufacturing MaterialsPackaging Materials

Covers substrate materials, manufacturing materials, and packaging materials for wafer fabrication, packaging and testing, and process material sourcing.

Precision PartsPower and Motion ControlSensing and Vision

Includes sealing rings, bearings, quartz and ceramic parts, power supplies, stepper and servo systems, valves, electrostatic chucks, flow meters, machine vision, sensors, and linear motors.

Overview

Introduction

- 2026年展会数据 -

1,100

Exhibitors (家)

70,000

Visitors (人)

60,000

Floor Area (m²)

Product Zones

Gallery

Organizer

Shenzhen Zhong Xin Cai Exhibition Co., Ltd. / Ai Ji Wei (Shanghai) Technology Co., Ltd. organizes and supports trade fair projects including International Integrated Circuit Innovation Expo 2026. Its work covers exhibitor services, visitor engagement, industry coordination, and on-site operations, helping companies present products, meet partners, and develop business opportunities.

The information contained herein is derived from publicly disclosed sources provided by the organizer. Independent verification is advised.