CIME Shanghai International Thermal Management Materials Technology Expo 2026 focuses on thermal management materials, thermal interface and heat dissipation materials, liquid cooling technologies, analytical instruments, and processing equipment for applications across electronics, automotive, data centers, and energy storage.

The event follows a dual-city format with a Shenzhen edition in June and a Shanghai edition in December, connecting material suppliers, equipment makers, application companies, and professional buyers across the thermal management supply chain.

Metal MaterialsCeramic Materials

Covers core electronic packaging materials including aluminum, copper, tungsten-copper, molybdenum-copper, silicon-aluminum, beryllium-aluminum, porous metals, ceramics, glass, and rubber.

Thermal Interface MaterialsPhase Change and Insulation Materials

Features thermal interface materials, gels, greases, pads, liquid metals, graphene thermal films, phase change materials, aerogels, and a wide range of heat sink composites.

Cold Plates and PipingCold Plate and Immersion Cooling

Focuses on cooling fluids, cold plates, connectors, pumps, valves, heat exchangers, coolant distribution units, and liquid cooling solutions including cold plate and immersion systems.

Battery Thermal ControlThermal Runaway Monitoring

Covers refrigerants, liquid and air cooling solutions, battery thermal management, fire safety, PCS thermal management, and thermal runaway monitoring technologies.

Thermal Property TestingCoating and Slitting Equipment

Includes laser thermal conductivity meters, thermal analyzers, dilatometers, airflow testing instruments, and processing equipment for calendaring, coating, slitting, die-cutting, cutting, and automated production lines.