Starts Soon
.svg)
Liquid Cooling Materials
CoolantsRefrigerantsFluorinated fluidsSilicone oil
The 8th Shanghai International Data Center Liquid Cooling and Heat Dissipation Exhibition 2026
Edition8 Bringing together data centers, cloud computing, and green computing infrastructure, attracting East China and export enterprise technology and infrastructure buyers.
The 8th Shanghai International Data Center Liquid Cooling and Heat Dissipation Exhibition 2026
Edition8 Bringing together data centers, cloud computing, and green computing infrastructure, attracting East China and export enterprise technology and infrastructure buyers.
The Shanghai International Data Center Liquid Cooling and Heat Dissipation Exhibition is a specialized exhibition in the liquid cooling and heat dissipation technology field, held in Shanghai. This is the 8th edition, focusing on liquid cooling products, technologies and solutions under the demand to lower data center PUE and dissipate computing power heat.
As big data and computing power demand grow, single-rack power density continues to rise, the share of liquid cooling in data centers increases, and there is still room for improvement in industrial ecosystem, cost and technology. The exhibition presents the latest products and technologies in the liquid cooling industry, organizing exchange around brand display, trade cooperation, market development and interaction among production, R&D and sales, helping exhibitors connect with buyers.
The exhibit scope includes liquid cooling raw materials such as coolants, refrigerants, fluorinated liquids, silicone oils and mineral oils; cold plate and immersion liquid cooling devices, heat dissipation components and temperature control components; piping and connectors such as hoses, metal pipes, corrugated pipes and quick connectors; and core technologies and key components such as cold plate liquid cooling, immersion liquid cooling and spray liquid cooling. It also covers material innovations such as high thermal conductivity metals, insulation and sealing materials, graphene thermal films, ceramic substrates and carbon nanotube composites.
The exhibits also extend to modular data centers, container data centers, edge computing liquid cooling solutions, liquid cooling system thermal simulation and intelligent operations platforms, and testing, certification and industry services such as thermal conductivity testing, energy efficiency certification and material compatibility testing. The previous edition had an exhibition area of 15,000 square meters, 368 exhibitors and a total of 21,216 visitor visits.
Area
Exhibitors
Visitors
The event is held from December 9 to 11, 2026.
The event is held at Shanghai New International Expo Centre.
Take Metro Line 2 to Longyang Road Station and walk, or transfer to Line 7 to Huamu Road Station.
A standard booth measures 3 m by 3 m.
The Shanghai International Data Center Liquid Cooling and Heat Dissipation Exhibition is a specialized exhibition in the liquid cooling and heat dissipation technology field, held in Shanghai. This is the 8th edition, focusing on liquid cooling products, technologies and solutions under the demand to lower data center PUE and dissipate computing power heat.
As big data and computing power demand grow, single-rack power density continues to rise, the share of liquid cooling in data centers increases, and there is still room for improvement in industrial ecosystem, cost and technology. The exhibition presents the latest products and technologies in the liquid cooling industry, organizing exchange around brand display, trade cooperation, market development and interaction among production, R&D and sales, helping exhibitors connect with buyers.
The exhibit scope includes liquid cooling raw materials such as coolants, refrigerants, fluorinated liquids, silicone oils and mineral oils; cold plate and immersion liquid cooling devices, heat dissipation components and temperature control components; piping and connectors such as hoses, metal pipes, corrugated pipes and quick connectors; and core technologies and key components such as cold plate liquid cooling, immersion liquid cooling and spray liquid cooling. It also covers material innovations such as high thermal conductivity metals, insulation and sealing materials, graphene thermal films, ceramic substrates and carbon nanotube composites.
The exhibits also extend to modular data centers, container data centers, edge computing liquid cooling solutions, liquid cooling system thermal simulation and intelligent operations platforms, and testing, certification and industry services such as thermal conductivity testing, energy efficiency certification and material compatibility testing. The previous edition had an exhibition area of 15,000 square meters, 368 exhibitors and a total of 21,216 visitor visits.
Area
Exhibitors
Visitors
The event is held from December 9 to 11, 2026.
The event is held at Shanghai New International Expo Centre.
Take Metro Line 2 to Longyang Road Station and walk, or transfer to Line 7 to Huamu Road Station.
A standard booth measures 3 m by 3 m.
19940848151
support@expofinder.com
