Shenzhen International Precision Ceramics and IGBT Industry Chain Expo 2026 focuses on precision ceramics, power semiconductors and related packaging and manufacturing links, and will be held at Shenzhen World Exhibition & Convention Center from June 10 to 12, 2026.

The event serves application markets such as 5G, consumer electronics, automotive electronics, new energy vehicles and semiconductors, showcasing MLCC, LTCC, HTCC, ceramic substrates, package housings, conductive pastes, metal materials, additives and IGBT industry chain materials and equipment for sourcing, technology exchange and business networking.

MLCCLTCCHTCC

Showcases MLCC, LTCC, HTCC, microwave dielectric ceramics, piezoelectric ceramics, powders and green tapes for electronic component and high-performance ceramic applications.

ZirconiaAluminum NitrideSemiconductor Ceramics

Covers structural ceramics, high-temperature ceramics, transparent ceramics, semiconductor ceramics, 3D-printed ceramics and SOFC membrane products for advanced manufacturing and functional ceramic applications.

DPCDBCAMB

Presents ceramic package housings, DPC/DBC/AMB substrates, HTCC and LTCC substrates, heat sinks and substrate materials such as alumina, aluminum nitride and silicon nitride for packaging and thermal management needs.

Silicon CarbidePackage HousingsVacuum Soldering Furnaces

Focuses on IGBT module materials, package housings, bonding wires, heat-dissipation substrates, thermal encapsulants and testing or soldering equipment across key power semiconductor packaging and manufacturing steps.