Covering IGBTs, MOSFETs, wide-bandgap semiconductors (SiC, GaN), power modules, intelligent power modules (IPMs), diodes, and thyristors.

PCIM Asia Shenzhen 2026 is an international exhibition and conference focused on power electronics, intelligent motion, renewable energy, and energy management. Following the PCIM brand format, the event combines exhibition and conference activities to connect device makers, system solution providers, research institutions, and downstream application companies across the value chain from power semiconductors and passive components to thermal management, drives, power conversion, and test and measurement.
The 2026 edition is expected to feature 30,000 square metres of exhibition space, 300+ exhibitors, and 28,000+ visits. The 2025 edition recorded 265 exhibitors and 16,971 visits, with exhibitors from 11 countries and regions and visitors from 50 countries and regions, showing the event's sustained relevance in Asia's power electronics market.
Covering IGBTs, MOSFETs, wide-bandgap semiconductors (SiC, GaN), power modules, intelligent power modules (IPMs), diodes, and thyristors.
Featuring power management ICs, motor driver ICs, gate driver ICs, ASICs, and related control chips.
Including capacitors, inductors, resistors, filters, magnetic components, and EMC components.
Showcasing ferrites, amorphous/nanocrystalline materials, magnetic powders, soft magnetic materials, transformer and inductor core materials.
Covering heat sinks, fans, heat pipes, thermal interface materials (TIM), liquid cooling systems, thermal simulation, and cooling solutions.
Featuring current sensors, voltage sensors, temperature sensors, Hall sensors, magnetic sensors, and related detection components.
Including PCB assemblies, power module packaging, lead frames, bonding wires, substrate materials, and packaging/testing services.
Covering motor drive systems, servo drives, frequency converters, motion controllers, and industrial drive solutions.
Featuring AC/DC converters, DC/DC converters, DC/AC inverters, on-board chargers (OBC), and DAB converters.



Guangzhou Guangya Messe Frankfurt Exhibition Co., Ltd. organizes and supports trade fair projects including 3D Printing Asia 2026, Guangzhou International Foundry, Die-casting & Forging Industry Exhibition 2026, and SPS - Smart Production Solutions Guangzhou 2026. Its work covers exhibitor services, visitor engagement, industry coordination, and on-site operations, helping companies present products, meet partners, and develop business opportunities.
Covering IGBTs, MOSFETs, wide-bandgap semiconductors (SiC, GaN), power modules, intelligent power modules (IPMs), diodes, and thyristors.
Featuring power management ICs, motor driver ICs, gate driver ICs, ASICs, and related control chips.
Including capacitors, inductors, resistors, filters, magnetic components, and EMC components.





Guangzhou Guangya Messe Frankfurt Exhibition Co., Ltd. organizes and supports trade fair projects including 3D Printing Asia 2026, Guangzhou International Foundry, Die-casting & Forging Industry Exhibition 2026, and SPS - Smart Production Solutions Guangzhou 2026. Its work covers exhibitor services, visitor engagement, industry coordination, and on-site operations, helping companies present products, meet partners, and develop business opportunities.