CIME focuses on thermal management, heat conduction and heat dissipation materials, components, equipment, and application solutions for sectors such as consumer electronics, 5G, artificial intelligence, data centers, power batteries, and energy storage.

The 16th Shenzhen edition will be held from June 10 to June 12, 2026 at Shenzhen International Convention and Exhibition Center, spanning 30,000 square meters and bringing together 600 exhibitors, 30 academic sessions, and 40,000 professional visits.

AluminaBoron NitrideEpoxy Resin

Covers inorganic and metallic thermal fillers, silicone and resin raw materials, plus metal, ceramic, and glass packaging materials for thermal formulation and electronic packaging applications.

Thermal Interface MaterialsGraphene Thermal FilmPhase Change Materials

Focuses on thermal gels, pads, liquid metal, thermally conductive plastics, carbon materials, phase change storage media, and insulation materials used in thermal management systems.

Cooling FansHeat PipesWater Cooling Radiators

Includes fan accessories, profile radiators, thermal modules, heat pipes, fin structures, and liquid cooling radiators for equipment-level thermal design and manufacturing.

Cold Plate Liquid CoolingImmersion CoolingThermal Simulation

Showcases liquid cooling plates, coolants, manifolds, pumps, valves, connectors, and cold-plate, immersion, and spray cooling solutions together with thermal control technologies and application cases.