Integrated Circuit and Advanced Packaging Equipment
Die BondingFlip-Chip PackagingWire Bonding

IC Packaging Fair 2026
A semiconductor packaging and testing show connecting equipment and material suppliers with OSAT, IDM and electronics manufacturing buyers.
Exhibitors
Visitors
Area

IC Packaging Fair 2026
A semiconductor packaging and testing show connecting equipment and material suppliers with OSAT, IDM and electronics manufacturing buyers.

Exhibitors
Visitors
Area