Integrated Circuit and Advanced Packaging Equipment
Die BondingFlip-Chip PackagingWire Bonding
IC Packaging Fair Shenzhen 2026
A semiconductor packaging and testing show connecting equipment and material suppliers with OSAT, IDM and electronics manufacturing buyers.
Exhibitors
Visitors
Area
IC Packaging Fair Shenzhen 2026
A semiconductor packaging and testing show connecting equipment and material suppliers with OSAT, IDM and electronics manufacturing buyers.
Exhibitors
Visitors
Area
17513601552
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