The 5th Shanghai International Precision Ceramics and Power Semiconductor Industry Chain Exhibition 2026 focuses on products, materials, equipment, and supporting solutions across the precision ceramics and IGBT / power semiconductor supply chain.

Held alongside the 17th Shanghai International Thermal Management Materials Technology Expo, the event serves brand promotion, trade cooperation, technical exchange, and professional buyer networking.

MLCCLTCC/HTCCAluminum Nitride

Showcases dielectric ceramics, piezoelectric ceramics, alumina, zirconia, aluminum nitride, glass powders, and related powders and green tape materials.

Silicon NitrideSilicon Carbide3D Printed Ceramics

Covers structural ceramics, high-temperature ceramics, transparent ceramics, new-energy ceramics, semiconductor ceramics, and 3D printed ceramic applications.

DPC/DBC/AMBHTCC/LTCC SubstratesHeat Sinks

Features ceramic packages, DPC/DBC/AMB substrates, HTCC/LTCC substrates, thin- and thick-film circuit boards, and related substrate materials.

Silver PasteCopper PowderSintering Additives

Includes silver, gold, and copper powders, solder materials, conductive pastes, and dispersants, binders, plasticizers, and sintering additives for ceramic processing.

Ball MillsTape Casting MachinesSintering Furnaces

Brings together ceramic processing equipment for powder treatment, forming, printing, lamination, sintering, coating, inspection, and automation.

Silicon CarbideBonding WiresVacuum Soldering Furnaces

Covers power semiconductor materials, package housings, thermal substrates, thermal interface materials, and packaging/test equipment for soldering, die attach, bonding, and inspection.